1. M5Stack recently launched the new AIOT(AI+IOT) Camera powered by Kendryte K210 -an edge computing system-on-chip(SoC) with dual-core 64bit RISC-V CPU and state-of-art neural network processor.
2. M5stick-V AI Camera features its integration with machine vision capabilities, featuring the unprocessed acceptability to AI Visioning with high energy efficiency and low cost. We co-oped with Sipeed providing the MicroPython environment makes programming onM5stick-V easier.
3.The module comes with the OmniVision OV7740 sensor, using the OmniPixel®3-HS technology, providing a best-in-class low light sensitivity, making it ideal for machine vision. In addition to an OV7740 sensor, M5stick-V features more hardware resources such as a speaker with built-in I2S Class-D DAC, IPS screen, 6-axle IMU, 200mAh Li-po battery, and more.
Features:
Dual-Core 64-bit RISC-V RV64IMAFDC (RV64GC) CPU / 400Mhz(Normal)
Dual Independent Double FPU
8MiB 64bit width On-Chip SRAM
Neural Network Processor(KPU) / 0.8Tops
Field-Programmable IO Array (FPIOA)
Dual hardware 512-point 16bit Complex FFT
SPI,I2C,UART,I2S, RTC,PWM,Timer Support
AES, SHA256 Accelerator
Direct Memory Access Controller (DMAC)
Micropython Support
Firmware encryption support
On-board Hardware resources:
- Flash: 16M.
- TFT: ST7789. 135*240 IPS 1.14 SPI
- Camera :OV7740
- PCM: MAX98357
-PMIC: AXP192
-Button: Front and side.
-Battery: 200mAh.
-Indicator light: RGBW .
-External storage: TF card/Micro SD
-Gy ro: MPU6886.
-Interface: CONNEXT
FUNCTIONAL DESCRIPTION:
1.1 KENDRYTE K210
The Kendryte K210 is a system-on-chip (SoC) that integrates machine vision . Using TSMC’s ultra-low-power 28-nm advanced process with dualcore 64-bit processors for better power efficiency, stability and reliability. The SoC strives for ”zero threshold” development and to be deployable in the user’s products in the shortest possible time, giving the product artificial intelligence
Machine Vision
Better low power vision processing speed and accuracy
KPU high performance Convolutional Neural Network (CNN) hardware accelerator
Advanced TSMC 28nm process, temperature area -40°C to 125°C
Firmware encryption support
Unique programmable IO array maximises design flexibility
Low voltage, reduced power consumption compared to other systems with the same processing power
3.3V/1.8V dual voltage IO support eliminates need for level shifters
1.1.1 CPU
The chip contains a high-performance, low power RISC-V ISA-based dual core 64-bit CPU with the following features:
Core Count: Dual-core processor
Bit Width: 64-bit CPU 400MHz
Frequency: 400MHz
ISA extensions: IMAFDC
FPU: Double
Platform Interrupts: PLIC
Local Interrupts: CLINT
I-Cache: 32KiB x 2
D-Cache: 32KiB x 2
On-Chip SRAM: 8MiB
1.2 OV7740
support for output formats: RAW RGB and YUV
support for image sizes: VGA, QVGA, CIF and any size smaller
support for black sun cancellation
support for internal and external frame synchronization
standard SCCB serial interface
digital video port (DVP) parallel output interface
embedded one-time programmable (OTP) memory
on-chip phase lock loop (PLL)
embedded 1.5 V regulator for core
Sophisticated Edge Rate Control Enables Filterless Class D Outputs
77dB PSRR at 1kHz
Low RF Susceptibility Rejects TDMA Noise from GSM Radios
Extensive Click-and-Po p Reduction Circuitry
1.2.1 SPECIFICATION
array size: 656 x 488
power supply: – core: 1.5VDC ± 5% – analog: 3.3V ± 5% – I/O: 1.7 ~ 3.47V
temperature Area: – operating: -30° C to 70°C – stable image: 0° C to 50° C
output format: – 8-/10-bit raw RGB data – 8-bit YUV
lens size: 1/5"
input clock frequency: 6 ~ 27 MHz
max image transfer rate: VGA (640x480): 60 fps – QVGA (320 x 240): 120 fp
sensitivity: 6800 mV/(Lux-sec)
maximum exposure interval: 502 x tROW
pixel size: 4.2 μm x 4.2 μm
image area: 2755.2 μm x 2049.6 μm
package/die dimensions: – CSP3: 4185 μm x 4345 μm – COB: 4200 μm x 4360 μm
1.3 MAX98357
Single-Supply Operation (2.5V to 5.5V).
3.2W Output Power into 4Ω at 5V
2.4mA Quiescent Current
92% Efficiency (RL = 8Ω, POUT = 1W)
22.8µVRMS Output Noise (AV = 15dB)
Low 0.013% THD+N at 1kHz
No MCLK Required
Sample Rates of 8kHz to 96kHz
Supports Left, Right, or (Left/2 + Right/2) Output
Sophisticated Edge Rate Control Enables Filterless Class D Outputs
77dB PSRR at 1kHz
Low RF Susceptibility Rejects TDMA Noise from GSM Radios
Extensive Click-and-Po p Reduction Circuitry
1.4 AXP192
Operation Voltage: 2.9V6.3V (AMR:-0.3V15V)
Configurable Intelligent Power Select system
Current and voltage limit of adaptive USB or AC adapter input
The resistance of inter1.5 MPU6886
1.5.1 GY RO SCOPE FEATURES
The triple-axle MEMS gy roscope in the MPU-6886 includes a wide area of features:
- Digital-output X-, Y-, and Z-axle angular rate sensors (gy roscopes) with a user-programmable full-scale area of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps and integrated 16-bit ADCs
- Digitally-programmable low-pass filter
- Low-power gy roscope operation
- Factory calibrated sensitivity scale factor
- lens size: 1/5”
- Self-test
1.5.2 ACCELEROMETER FEATURES
The triple-axle MEMS accelerometer in MPU-6886 includes a wide area of features:
- Digital-output X-, Y-, and Z-axle accelerometer with a programmable full scale area of ±2g, ±4g, ±8g and ±16g and integrated 16-bit ADCs
- User-programmable interrupts
- Wake-on-motion interrupt for low power operation of applications processor
- Self-test
1.6. ANOTHER HARDWARES
- Flash: 16M.
- TFT: ST7789. 135*240 IPS 1.14 SPI
- Button: Front and side.
- Battery: 200mAh.
- Indicator light: RGBW.
- External storage: TF card/Micro SD
- Gy ro: MPU6886.
- Interface: CONNECT.
Applications/What can M5Stick-V do?
- Face recognition/detection
- Object detection/classification
- Obtaining size and coordinates of the target in real-time
- Obtaining the type of detected target in real-time
- Shape recognition
- Video/Display
Package Included:
1 x M5Stack StickV K210 AI Camera Development Board
1 x Type-C USB Cable
